FIP Seminar: Harnessing Light for Sensing, Communications, Metrology and Manufacturing
We present key theoretical and experimental results of our investigations into novel photonic devices, quantitative optical imaging, and light assisted semiconductor manufacturing. The photonic devices include palladium based optical hydrogen sensors, reflective microring resonators, and hybrid microring/plasmonic bio-sensors. We will also present diffraction phase microscopy (DPM) as a non-destructive optical method for monitoring physical processes in real time and with nanometer level sensitivity. We have used DPM to observe the dynamics of semiconductors during wet etching, surface wetting and evaporation of water droplets, the dissolution of biodegradable electronics, and the stretching of thin films due to heating or lattice expansion. Next, we will discuss how to use DPM and emerging near-field imaging techniques to detect defects in patterned semiconductor wafers. In particular, we will report on light focusing and photonic nanojet formation using our cascaded asymmetric microstructure. Finally, we will get into how to use light from an ordinary computer projector to perform photochemical etching in order to define variable height topography during semiconductor manufacturing.